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FAQ

What are the Solutions to address Sink Marks and Voids in MIM?

Date:2025-07-28   Views:1002

Formation Mechanisms

During MIM molding, precise control of temperature and pressure is critical. Low molding or hold pressure causes:

  • Regions of low green density

  • Incomplete cavity filling

Poor vent design combined with long runners leads to:

  • Premature gate solidification

  • Internal voids at thick sections

These low-density zones/voids form pits (sink marks) after sintering.


Root Cause Summary

Defect

Primary Causes

Voids

Gas entrapment, moisture absorption

Sink Marks

Thermal shrinkage, low density

 

Possible Solutions

  • Increase hold pressure & molding pressure

  • Enlarge gates

  • Add venting channels

  • Reduce speed through thick sections OR Relocate gates to thick sections

 

Critical Trade-offs

Parameter

Adjustment for Voids

Adjustment for Sink Marks

Injection Speed

↓ Reduce

↑ Increase

Mold Temperature

↑ Increase

↓ Reduce

*Optimization requires balancing conflicting measures to find the optimal ratio.


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