How does Deformation occur during Thermal Debinding? How can it be resolved?

Date：2025-07-29   Views：1001

(Background: The defects that arise after thermal debinding of green parts are not necessarily related to the thermal debinding process itself, but may originate from previous processes such as mixing and granulation, injection molding, or solvent debinding, and are amplified and made visible during the thermal debinding process. During thermal debinding heating, the temperature should be controlled to ensure a slow temperature rise, as defects in thermal debinding can occur when the heating rate is too fast, due to the rapid decomposition of binder components.)

Mechanism:

At the end of thermal debinding, only a small amount of binder remaining in the intergranular neck is not removed. The capillary forces caused by these residues prompt the particles to rearrange, inducing internal stress and deformation.

Causes:

• Too rapid heating during thermal debinding

• Insufficient removal of binder during solvent debinding

• Lack of support for complex structures (e.g., cantilevers)

• Excessive binder content, resulting in insufficient interparticle friction

Solutions:

• Reduce heating rate

• Extend solvent debinding time

• Use fixtures or sand as support during debinding

• Increase gas purging rate

• Increase powder packing density to reduce particle displacement